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System Overview: Dell™ PowerEdge™ 2550 Systems Service Manual

Overview Service Features
System Features Technical Specifications

Overview

The system, which has single or dual Intel® Pentium® III microprocessors, is an ultra-slimline, full-featured, rack-mounted server. The system provides a robust, reliable, rack-optimized platform on which both large and small customers can deploy their mission-critical applications.

This section describes the system’s major hardware and software features, provides information about the indicators and controls on the system's front panel, and discusses connecting external devices.


System Features

The system offers the following major features:

note.gif (515 bytes) NOTE: If you decide to upgrade the system by installing a second microprocessor, you must order a microprocessor upgrade kit from Dell. Not all versions of the Pentium III microprocessor work properly as a second microprocessor. The upgrade kit from Dell contains the correct version of the microprocessor for use as a second microprocessor as well as instructions for performing the upgrade.  Both microprocessors must have the same part number, revision (or stepping) code, internal operating frequency, and cache size.

The system board includes the following features:

Standard systems include a combined 3.5-inch diskette drive and an IDE CD-ROM drive installed in an externally accessible bay and a SCSI hard-disk drive installed in slot 0.

The following software is included in the system:


Service Features

The system includes the following service features to make troubleshooting and repair easy and effective, in most cases without tools or service aids:

The system chassis simplifies removing and replacing system components. You can replace microprocessors or memory modules without removing the system board. The Dell-designed SCSI backplane board and hard-disk drive carriers eliminate the extensive cabling and drive configuration usually required for a SCSI subsystem.


Technical Specifications

Processor

Microprocessor type dual Intel Pentium III microprocessors with a minimum internal operating frequency of 933 MHz
Front side bus 133 MHz
Internal cache 256KB of SDRAM internal to microprocessor
Math coprocessor internal to microprocessor

Expansion Bus

Bus types PCI bus
Expansion slots three full-length dedicated 64 bit 33 MHz PCI slots: PCI1 through PCI3

Memory

DIMM sockets four 72-bit wide, 168-pin sockets
DIMM capacities 64-, 128-, 256-, 512-MB, or 1-GB registered SDRAM DIMMs; must be certified for 133-MHz operation
Minimum RAM 128 MB
Maximum RAM 4 GB (using 1-GB registered SDRAM DIMMs)
External cache none

Drives

Diskette drive 3.5-inch, 1.44-MB diskette drive included with standard system
Tape drive 20 GB and higher (optional)
SCSI hard-disk drives up to four slots in hard-disk drive bay support formatted capacities of 9 GB and higher
SCSI devices an internal SCSI backplane provides a physical connection, hot-plug capability with RAID controller, termination, and automatic configuration for up to five internal SCSI hard-disk drives; an integrated Adaptec Ultra3 AIC-7899 SCSI host adapter
CD-ROM drive 24X enhanced IDE CD-ROM drive included with standard system

External Ports and Connectors

Serial   two 9-pin connectors
Parallel  (bidirectional) 25-pin connector
Video 15-pin connector
PS/2-style keyboard six-pin mini-DIN connector
PS/2-compatible mouse six-pin mini-DIN connector
USB two USB-compliant 4-pin connectors
Ethernet two RJ45 connectors for connection to the integrated NIC (Intel 82559 10/100-Mbps Ethernet controller) and Gigabit Ethernet controller

Video

Video type integrated ATI-RAGE XL PCI video controller; VGA connector
Video memory 8-MB SDRAM

Power

Hot-pluggable DC power supply:
    Wattage 330 W (each supply)
    Heat dissipation 1580 BTU/hr (maximum)
    Input voltage 100 to 240 V at 50–60 Hz
autoranging
    Output voltages
    and maximum
    current
+5 VDC at 35 A
+3.3 VDC at 10 A
+12 VDC at 18 A
–12 VDC at 0.8 A
–5 VDC at 0.3 A
+5 Vfp (volts flea power) at 1.2 A
Backup battery 3-V CR2032 lithium coin cell

Physical

Rack mount (2U):
      Height 8.4 cm (3.3 inches)
      Width 42.4 cm (16.7 inches)
      Depth 66.8 cm (26.3 inches)
      Weight 15.87 kg (35.0 lb) minimum configuration
24.94 kg (55.0 lb) maximum configuration

Environmental

Temperature:
      Operating 10°C to 35°C (50°F to 95°F)
      Storage –40°C to 65°C (–40°F to 149°F)
Relative humidity:
      Operating 8% to 80% (noncondensing) 10% per hour gradient
      Storage 5% to 95% (noncondensing)
Maximum vibration:
      Operating 0.25 G (half-sine wave) at a sweep of 3 to 200 Hz for 15 minutes
      Storage 0.5 G at 3 to 200 Hz for 15 minutes
Maximum shock:
      Operating six consecutive shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) at 41 G for 2 milliseconds
      Storage
      (non-operational)
six consecutive shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) at 71 G for 2 milliseconds
Altitude:
      Operating –16 to 3048 m (–50 to 10,000 ft)
      Storage –16 to 10,600 m (–50 to 35,000 ft)

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